| Description |
1 online resource |
| Summary |
"Synthesising 15 years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design"-- Provided by publisher |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Description based on online resource; title from digital title page (viewed on October 06, 2021) |
| Subject |
Interconnects (Integrated circuit technology)
|
|
Three-dimensional integrated circuits.
|
|
Optical interconnects.
|
|
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General.
|
|
Interconnects (Integrated circuit technology)
|
|
Optical interconnects
|
|
Three-dimensional integrated circuits
|
| Form |
Electronic book
|
| Author |
Yip, Wai-Yeung, author
|
| LC no. |
2021028685 |
| ISBN |
9781108893299 |
|
1108893295 |
|
