| Description |
1 online resource (691 pages) |
| Series |
IEEE Press Series |
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IEEE Press Series
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| Contents |
Cover -- Title Page -- Copyright Page -- Contents -- About the Authors -- Preface -- Acknowledgments -- Chapter 1 Introduction -- 1.1 Basics of Three-Phase AC Converters -- 1.1.1 Basic Applications -- 1.1.2 Basic Topologies -- 1.1.3 Composition of Three-Phase AC Converters -- 1.2 Basics of Three-Phase AC Converter Design -- 1.2.1 Essence of the Design and Design Tasks -- 1.2.2 Design Procedure, Strategy, and Philosophy -- 1.3 Goal and Organization of This Book -- References -- Part I Components -- Chapter 2 Power Semiconductor Devices -- 2.1 Introduction -- 2.2 Static Characteristics -- 2.2.1 Output Characteristics -- 2.2.2 On-state Characteristics -- 2.2.3 Transfer Characteristics of Active Power Switch -- 2.2.4 Leakage Current and Breakdown Voltage -- 2.2.5 Junction Capacitance -- 2.2.6 Gate Charge -- 2.3 Switching Characteristics -- 2.3.1 Model -- 2.3.2 Method -- 2.4 Thermal Characteristics -- 2.4.1 Model -- 2.4.2 Method -- 2.5 Other Attributes -- 2.5.1 SOA -- 2.5.2 Reliability Characteristics -- 2.5.3 Mechanical Characteristics -- 2.5.4 Nonstandard Characteristics -- 2.6 Scalability (Parallel/Series) -- 2.7 Relevance to Converter Design -- 2.8 Summary -- References -- Chapter 3 Capacitors -- 3.1 Introduction -- 3.2 Capacitor Types and Technologies -- 3.2.1 Ceramic Capacitors -- 3.2.2 Paper -- 3.2.3 Mica -- 3.2.4 Poly-Film -- 3.2.5 Aluminum Electrolytic Capacitors (AECs) -- 3.2.6 Tantalum Electrolytic Capacitors (TECs) -- 3.2.7 Capacitor Technologies Comparison -- 3.2.8 Emerging Capacitor Technologies -- 3.3 Capacitor Selection in a Converter Design -- 3.4 Capacitor Characteristics and Models -- 3.4.1 Capacitor Equivalent Circuit Model and Capacitance -- 3.4.2 Voltage and Current Capability Models -- 3.4.3 Loss and Thermal Models -- 3.4.4 Lifetime Model -- 3.5 Capacitor Bank (Parallel/Series) |
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3.5.1 Capacitor Bank Configuration and Voltage Balancing -- 3.5.2 Capacitor Bank Layout for Parasitic Inductance Reduction -- 3.6 Relevance to Converter Design -- 3.6.1 Capacitor Scaling -- 3.6.2 AC Capacitor Classification -- 3.7 Summary -- References -- Chapter 4 Magnetics -- 4.1 Introduction -- 4.2 Magnetic Core Materials and Construction -- 4.2.1 Soft Magnetic Alloy-Based Laminated, Tape Wound and Cut Cores -- 4.2.2 Powder Cores -- 4.2.3 Ferrite Cores -- 4.3 Inductor Design in a Converter -- 4.4 Inductor Characteristics and Models -- 4.4.1 Inductance and Permeability -- 4.4.2 Flux Density and Core Saturation -- 4.4.3 Fill Factor -- 4.4.4 Current Density and Core Window Area Product Ap -- 4.4.5 Core Loss -- 4.4.6 Winding Loss -- 4.4.7 Temperature Rise -- 4.4.8 Leakage Inductance -- 4.4.9 Fringing Effect of Gapped Cores -- 4.5 Relevance to Converter Design -- 4.5.1 Capacitor Winding Capacitance -- 4.6 Summary -- References -- Part II Subsystems Design -- Chapter 5 Passive Rectifiers -- 5.1 Introduction -- 5.2 Passive Rectifier Design Problem Formulation -- 5.2.1 Passive Rectifier Design Variables -- 5.2.2 Passive Rectifier Design Constraints -- 5.2.3 Passive Rectifier Design Conditions -- 5.2.4 Passive Rectifier Design Objectives and Design Problem Formulation -- 5.3 Passive Rectifier Models -- 5.3.1 AC Input Harmonic Current -- 5.3.2 Minimum and Maximum DC Voltages Under Normal Operating Conditions -- 5.3.3 Ride-Through or Holdup Time Without Input Power -- 5.3.4 DC-Link Stability -- 5.3.5 Device-Related Constraints -- Inrush -- 5.3.6 Inductor-Related Constraints and Design -- 5.3.7 Capacitor-Related Constraints and Selection -- 5.4 Passive Rectifier Design Optimization -- 5.5 Interface to Other Subsystem Designs -- 5.5.1 General Classifications -- 5.5.2 Discussion -- 5.6 Summary -- References -- Chapter 6 Load-side Inverters -- 6.1 Introduction |
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6.2 Load-side Inverter Design Problem Formulation -- 6.2.1 Load-side Inverter Design Variables -- 6.2.2 Load-side Inverter Design Constraints -- 6.2.3 Load-side Inverter Design Conditions -- 6.2.4 Load-side Inverter Design Objectives and Design Problem Formulation -- 6.3 Load-side Inverter Models -- 6.3.1 AC Load Harmonic Current -- 6.3.2 Inverter Power Loss -- 6.3.3 Control Performance -- 6.3.4 Device Maximum Junction Temperature -- Maximum Thermal Impedance Requirement -- 6.3.5 Device Switching Overvoltage -- 6.3.6 Decoupling Capacitor -- 6.3.7 Decoupling Inductor -- 6.4 Load-side Inverter Design Optimization -- 6.5 Load-side Inverter Interfaces to Other Subsystem Designs -- 6.5.1 General Classifications -- 6.5.2 Discussion -- 6.6 Summary -- References -- Chapter 7 Active Rectifiers and Source-side Inverters -- 7.1 Introduction -- 7.2 Active Rectifier and Source-side Inverter Design Problem Formulation -- 7.2.1 Active Rectifier and Source-side Inverter Design Variables -- 7.2.2 Active Rectifier or Source-side Inverter Design Constraints -- 7.2.3 Active Rectifier and Load-side Inverter Design Conditions -- 7.2.4 Active Rectifier and Source-side Inverter Design Objectives and Design Problem Formulation -- 7.3 Active Rectifier and Source-side Inverter Models -- 7.3.1 AC Source Harmonic Current -- 7.3.2 Control Performance -- 7.3.3 DC-Link Stability -- 7.3.4 Reliability -- 7.4 Active Rectifier and Source-side Inverter Design Optimization -- 7.5 Impact of Topology -- 7.5.1 Circuit Modeling for Different Topologies -- 7.5.2 Topology Impact on Device Models -- 7.6 Active Rectifier and Source-side Inverter Interfaces to Other Subsystem Designs -- 7.7 Summary -- References -- Chapter 8 EMI Filters -- 8.1 Introduction -- 8.2 EMI Filter Design Basics -- 8.2.1 EMI/EMC Standards -- 8.2.2 Definition of CM and DM Noise -- 8.2.3 EMI Noise Measurement |
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8.2.4 Basic EMI Filter Design Method -- 8.2.5 EMI Filter Topology -- 8.3 EMI Filter Design Problem Formulation -- 8.3.1 EMI Filter Design Variables -- 8.3.2 EMI Filter Design Constraints -- 8.3.3 EMI Filter Design Conditions -- 8.3.4 EMI Filter Design Objectives and Design Problem Formulation -- 8.4 EMI Filter Models -- 8.4.1 EMI Noise Source Model -- 8.4.2 EMI Propagation Path Impedance Model -- 8.4.3 EMI Filter Corner Frequency vs. Switching Frequency -- 8.5 EMI Filter Design Optimization and Some Practical Considerations -- 8.5.1 Grounding Effect -- 8.5.2 EMI Filter Coupling -- 8.5.3 Mixed-Mode Noise -- 8.5.4 EMI Noise Mode Transformation Due to Propagation Path Unbalance -- 8.6 EMI Noise and Filter Reduction Techniques -- 8.6.1 Switching Frequency -- 8.6.2 Modulation Scheme -- 8.6.3 EMI Filter Topology -- 8.6.4 Active/Hybrid Filter -- 8.6.5 Paralleled Converters Interleaving Angle Optimization -- 8.6.6 EMI Filter Integration -- 8.7 Interface to Other Subsystem Designs -- 8.7.1 Voltage Distribution -- 8.7.2 Current Distribution -- 8.7.3 Input/Output Terminals -- 8.7.4 Load-side dv/dt -- 8.8 Summary -- References -- Chapter 9 Thermal Management System -- 9.1 Introduction -- 9.2 Cooling Technology Overview -- 9.2.1 Basic Conventional Cooling Methods for Power Electronics -- 9.2.2 Advanced Cooling Techniques -- 9.2.3 Comparison of Cooling Technologies -- 9.2.4 Heatsinks and Other Components -- 9.3 Thermal Management System Design Problem Formulation -- 9.3.1 Thermal Management System Design Variables -- 9.3.2 Thermal Management System Design Constraints -- 9.3.3 Thermal Management System Design Conditions -- 9.3.4 Thermal Management System Design Objectives and Design Problem Formulation -- 9.4 Thermal Management System Models -- 9.4.1 Thermal Impedance -- 9.4.2 Heatsink Dimensions -- 9.5 Thermal Management System Design Optimization |
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9.5.1 Design Optimization Example -- 9.5.2 Design Verification -- 9.6 Thermal Management System Interface to Other Subsystems -- 9.6.1 General Classification -- 9.6.2 Discussion -- 9.7 Other Cooling Considerations -- 9.7.1 Force-Liquid Convection Cooling -- 9.7.2 Cooling for Passives -- 9.8 Summary -- References -- Chapter 10 Control and Auxiliaries -- 10.1 Introduction -- 10.2 Control Architecture -- 10.2.1 System Control Layer -- 10.2.2 Application Control Layer -- 10.2.3 Converter Control Layer -- 10.2.4 Switching Control Layer -- 10.2.5 Hardware Control Layer -- 10.3 Control Hardware Selection and Design -- 10.4 Isolation -- 10.4.1 Signal Isolator -- 10.4.2 Isolated Power Supply -- 10.4.3 Discussion on Isolation Strategies for Low-Power Converter Design -- 10.5 Gate Driver -- 10.5.1 Gate Driver Fundamentals -- 10.5.2 Gate Driver-Related Key Device Characteristics -- 10.5.3 Gate Driver Design -- 10.5.4 Bootstrap Gate Driver -- 10.6 Sensors and Measurements -- 10.6.1 Voltage Sensors -- 10.6.2 Current Sensors -- 10.6.3 Temperature Sensors -- 10.6.4 High-Voltage Sensors -- 10.6.5 Sensing Circuit Design Considerations for High-Frequency WBG Converters -- 10.7 Protection -- 10.7.1 Device-Level Protection -- 10.7.2 Converter-Level Protection -- 10.8 Printed Circuit Boards -- 10.9 Deadtime Setting and Compensation -- 10.9.1 Deadtime Setting -- 10.9.2 Deadtime Compensation -- 10.10 Interface to Other Subsystems -- 10.11 Summary -- References -- Chapter 11 Mechanical System -- 11.1 Introduction -- 11.2 Mechanical System Design Problem Formulation -- 11.2.1 Mechanical System Design Variables -- 11.2.2 Mechanical System Design Constraints -- 11.2.3 Mechanical System Design Conditions -- 11.2.4 Mechanical System Design Objectives and Design Problem Formulation -- 11.3 Busbar Design -- 11.3.1 Busbar Design Problem Formulation |
| Notes |
11.3.2 Busbar Design Procedures and Considerations |
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Description based on publisher supplied metadata and other sources |
| Form |
Electronic book
|
| Author |
Zhang, Zheyu
|
|
Chen, Ruirui
|
| ISBN |
1119794269 |
|
9781119794264 |
|
1119794250 |
|
9781119794257 |
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