| Description |
1 online resource (849 pages) : 550 illustrations |
| Contents |
Title Page -- Copyright Page -- Dedication -- Contents -- Contributors -- Preface -- 1 Introduction to Device and Systems Packaging Technologies -- 1.1 What Is Packaging and Why? -- 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View -- 1.3 Devices and Moore?s Law -- 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices -- 1.5 Packaging and Moore?s Law for Packaging -- 1.6 Electronic Systems Technologies Trends -- 1.7 Future Outlook -- 1.8 How the Book Is Organized -- 1.9 Homework Problems -- 1.10 Suggested Reading -- Part 1 Fundamentals of Packaging -- 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference -- 3 Fundamentals of Thermal Technologies -- 4 Fundamentals of Thermo-Mechanical Reliability -- 5 Fundamentals of Package Materials at Microscale and Nanoscale -- 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates -- 7 Fundamentals of Passive Components and Integration with Active Devices -- 8 Fundamentals of Chip-to-Package Interconnections and Assembly -- 9 Fundamentals of Embedded and Fan-Out Packaging -- 10 Fundamentals of 3D Packaging with and without TSV -- 11 Fundamentals of RF and Millimeter-Wave Packaging -- 12 Fundamentals of Optoelectronics Packaging -- 13 Fundamentals of MEMS and Sensor Packaging -- 14 Fundamentals of Package Encapsulation, Molding, and Sealing -- 15 Fundamentals of Printed Wiring Boards -- 16 Fundamentals of Board Assembly -- Part 2 Applications of Packaging Technologies -- 17 Applications of Packaging Technologies in Future Car Electronics -- 18 Applications of Packaging Technologies in Bioelectronics -- 19 Applications of Packaging Technologies in Communication Systems -- 20 Applications of Packaging Technologies in Computing Systems -- 21 Applications of Packaging Technologies in Flexible Electronics -- 22 Applications of Packaging Technologies in Smartphones -- Index |
| Summary |
A thoroughly revised, comprehensive guide to microelectronic device and systems packaging. This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next--from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law. -- Provided by publisher |
| Bibliography |
Includes bibliographical references and index |
| Notes |
E-Publication PDF |
| Subject |
Microelectronic packaging.
|
|
TECHNOLOGY & ENGINEERING / Electrical.
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Microelectronic packaging.
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| Form |
Electronic book
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| ISBN |
9781259861567 |
|
1259861562 |
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