| Description |
1 online resource |
| Series |
Woodhead Publishing series in electronic and optical materials |
|
Woodhead Publishing series in electronic and optical materials.
|
| Summary |
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Online resource; title from PDF title page (EBSCO, viewed November 9, 2018) |
| Subject |
Electronic packaging.
|
|
TECHNOLOGY & ENGINEERING -- Mechanical.
|
|
Electronic packaging
|
| Form |
Electronic book
|
| ISBN |
9780081023921 |
|
0081023928 |
|
008102391X |
|
9780081023914 |
|
