Title Routing in the third dimension : from VLSI chips to MCMs / Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam

Published Piscataway, NJ : IEEE Press ; New York : Institute of Electrical and Electronics Engineers, ©1995

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Description 1 online resource (xviii, 358 pages) : illustrations Summary This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. Youll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area Bibliography Includes bibliographical references (pages 335-350) and indexes Notes Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL Print version record digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL Subject Integrated circuits -- Very large scale integration -- Computer-aided design Multichip modules (Microelectronics) -- Computer-aided design Integrated circuits -- Very large scale integration -- Computer-aided design Multichip modules (Microelectronics) -- Computer-aided design Boîtier multipuce (Microélectronique) Conception assistée par ordinateur. Circuit intégré à très grande échelle. Genre/Form Electronic books Form Electronic book Author Bhingarde, Siddharth Panyam, Anand ISBN 9780470546376 0470546379 9780780310896 0780310896

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