Title Materials for high-density electronic packaging and interconnection

Published Washington, D.C. : National Academy Press, 1990

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Description 1 online resource (xiv, 139 pages) : illustrations Notes Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council Available from Defense Technical Information Center, Cameron Station "NMAB-449." Bibliography Includes bibliographical references Notes Print version record Subject Electronic packaging -- Materials TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics. TECHNOLOGY & ENGINEERING -- Electronics -- Digital. Electronic packaging -- Materials Form Electronic book ISBN 0585143951 9780585143958 030904233X 9780309042338

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