| Description |
1 online resource (xii, 190 pages, 4 unnumbered pages of plates) : illustrations (some color) |
| Series |
2010 Springer E-Books
|
| Contents |
Background of 2.5-D VLSI Integration -- Cost Modeling of VLSI Integration Strategies -- Custom Design Case Studies of 2.5-D Integration -- ASIC Design Case Studies with 2.5-D Layout Design Automation Tools -- Looking into The Future |
| Summary |
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R & D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U.A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Integrated circuits -- Very large scale integration -- Design and construction
|
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COMPUTERS -- Logic Design.
|
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Logic.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- VLSI & ULSI.
|
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Integrated circuits -- Very large scale integration -- Design and construction.
|
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Ingénierie.
|
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Integrated circuits -- Very large scale integration -- Design and construction
|
| Form |
Electronic book
|
| Author |
Maly, W
|
| ISBN |
9783642041570 |
|
3642041574 |
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