Ch. 1. Introduction to Microvia and WLCSP Technologies -- Ch. 2. Conventional Printed Circuit Board Technologies -- Ch. 3. Microvias by Mechanical Drilling -- Ch. 4. Microvias by Laser Drilling -- Ch. 5. Microvias by Photoimaging -- Ch. 6. Microvias by Etching -- Ch. 7. Conductive Paste/Ink-filled Microvias -- Ch. 8. Special High-Density Interconnects for Flip Chip Applications -- Ch. 9. Solders for Next-Generation High-Density Interconnects -- Ch. 10. Solder-Bumped Flip-Chip WLCSP -- Ch. 11. Assembly of Flip Chip on PCB/Substrate -- Ch. 12. Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates
Summary
A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile phones and other handheld electronic products, otherwise they would be twice their current size
Bibliography
Includes bibliographical references and index
Notes
Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL
English
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