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Authors (Last name first) (1-12 of 12)
Lau, John H.,
1 2016 3D IC integration and packaging Lau, John H., author New York : McGraw-Hill Education, [2016] Rating: Electronic Resources
2 2010 Advanced MEMS packaging Rating: Electronic Resources
3 2020 Assembly and reliability of lead-free solder joints Lau, John H. Rating: Electronic Resources
4 2023 Chiplet design and heterogeneous integration packaging Lau, John H., author. Singapore : Springer, [2023] Rating: Electronic Resources
5 2003 Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials Rating: Electronic Resources
6 2018 Fan-out wafer-level packaging Lau, John H., author Singapore : Springer, 2018 Rating: Electronic Resources
7 2024 Flip chip, hybrid bonding, fan-in, and fan-out technology Lau, John H Rating: Electronic Resources
8 2019 Heterogeneous integrations Lau, John H., author Singapore : Springer, 2019 Rating: Electronic Resources
9 2001 Microvias : for low cost, high density interconnects Lau, John H. Rating: Electronic Resources
10 2011 Reliability of RoHS-Compliant 2D and 3D IC interconnects Lau, John H. Rating: Electronic Resources
11 2021 Semiconductor advanced packaging Lau, John H., author. Singapore : Springer, [2021] Rating: Electronic Resources
12 2013 Through-silicon Vias for 3D Integration Lau, John H Rating: Electronic Resources
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