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Author
International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Title
Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / edited by Yanwen Wu
Published
Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011
Click on the following:
EBSCO eBooks
Copies
Description
1 online resource (pages)
Series
Key engineering materials, 1662-9795 ; v. 460-461
Key engineering materials ; v. 460/461.
Subject
Electronic apparatus and appliances -- Congresses
Electronic packaging -- Congresses
Microelectronic packaging -- Congresses
Manufacturing processes -- Congresses
TECHNOLOGY & ENGINEERING -- Engineering (General)
TECHNOLOGY & ENGINEERING -- Reference.
Electronic apparatus and appliances
Electronic packaging
Manufacturing processes
Microelectronic packaging
Genre/Form
Conference papers and proceedings
Form
Electronic book
Author
Wu, Yanwen.
ISBN
9783038134800
3038134805
Other Titles
ICCPMT 2010
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