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Book Cover
E-journal
Author International Advanced Packaging Materials Symposium

Title Proceedings / International Advanced Packaging Materials Symposium
Published Piscataway, NJ : IEEE Service Center
Online access available from:
IEEE Xplore    01 Jan. 1997-
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Description Online resource
Prior Title International Symposium on Advanced Packaging Materials. Proceedings
Later Title IEEE International Symposium on Advanced Packaging Materials. ... IEEE International Symposium on Advanced Packaging Materials
Issuing Body Sponsored by: IEEE Components, Packaging and Manufacturing Technoiogy [and] Georgia Tech Packaging Research Center
Notes Surrogate of: 8th (2002)
Subject Electronic packaging -- Materials -- Congresses
Form Electronic journal
Author Components, Packaging & Manufacturing Technology Society
Georgia Institute of Technology. Packaging Research Center
LC no. 2004212688
ISSN 1550-5723
OTHER TI Proceedings (International Advanced Packaging Materials Symposium)