Title Proceedings of the ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems -2020 - : presented at ASME 2020 International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems, October 27-29, 2020, Online / sponsored by Electronic and Photonic Packaging Division, ASME

Published New York, N.Y. : The American Society of Mechanical Engineers, [2020]

Online access available from: ASME    View Resource Record

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Description 1 online resource (various pagings) : illustrations (black and white) Notes Cancelled due to Covid-19, held online Bibliography Includes bibliographical references and author index Notes Current copyright fee: GBP22.22 123\0. Uk Form Electronic book Author American Society of Mechanical Engineers, publisher American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, sponsoring body

Other Titles InterPACK2020

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