| Description |
1 online resource (314 p.) |
| Contents |
Cover -- Half Title -- Title Page -- Copyright Page -- Contents -- Preface -- Author -- PART I: Introduction -- Chapter 1: Introduction -- 1.1. The Semiconductor Revolution -- 1.2. History of Flexible Electronics -- 1.3. Need for Flexible Electronics -- 1.4. Example Applications -- Chapter 2: Physics of Flexible Electronics -- 2.1. Why Are Things Flexible? -- 2.2. Bending Radius and Curvature -- 2.3. Plate Flexure -- 2.3.1. Flexure -- 2.3.2. Buckling -- 2.4. The Ball-Spring Model -- 2.5. Flexibility in Polymers -- Exercises -- Chapter 3: Semiconductor Basics -- 3.1. The Silicon Atom |
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3.2. The Silicon Lattice -- 3.3. Doping Silicon -- 3.4. Semiconductor Fabrication Techniques -- 3.4.1. The Silicon Wafer -- 3.4.2. Deposition -- 3.4.3. Lithography -- 3.4.4. Etching -- 3.5. Silicon Transistors -- 3.5.1. Thin-Film Transistors -- Exercises -- PART II: Materials -- Chapter 4: Flexible Silicon -- 4.1. The Story of Silicon -- 4.2. Silicon Substrates -- 4.2.1. Crystallography -- 4.2.2. Charge Transport -- 4.2.3. Semiconductor/Oxide Interface -- 4.3. Flexible Monocrystalline Silicon -- 4.3.1. Device-Last Approach -- 4.3.2. Device-First Approach -- 4.3.2.1. Top-Down Method |
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4.3.2.2. Bottom-Up Method -- 4.4. Silicon TFTs -- Exercises -- Chapter 5: Organic Electronic Materials -- 5.1. Introduction -- 5.2. Conduction in Organic Molecules -- 5.3. Properties of Organic Conduction -- 5.3.1. Carrier Mobility -- 5.3.2. Electron-Hole Stability -- 5.3.3. Polaron Transport -- 5.4. Organic Small Molecules -- 5.5. Organic Polymers -- 5.5.1. Copolymers -- 5.6. Organic Thin Film Deposition -- 5.7. Organic Single-Crystals -- 5.8. Organic Field-Effect Transistors (OFETs) -- Exercises -- Chapter 6: Metal Oxide Semiconductors -- 6.1. Introduction |
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6.2. Metal Oxide Semiconductor Properties -- 6.3. Ternary and Quaternary Metal Oxides -- 6.4. Deposition Techniques -- 6.4.1. Vacuum Deposition -- 6.4.2. Solution Processing -- 6.5. Metal Oxide TFTs -- 6.5.1. Wavy Channel TFTs -- Exercises -- Chapter 7: III-V Semiconductors -- 7.1. Introduction -- 7.2. Properties -- 7.3. III-V Wafers -- 7.3.1. Epitaxy -- 7.4. Flexible III-V Semiconductors -- 7.5. III-V Thin Films -- Exercises -- Chapter 8: Nanostructured Materials -- 8.1. Introduction -- 8.2. Two-Dimensional Materials -- 8.2.1. Graphene -- 8.2.2. Transition Metal Dichalcogenides (TMDs) |
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8.2.3. Hexagonal Boron Nitride (H-BN) -- 8.2.4. Other 2D Materials -- 8.3. One-Dimensional Materials -- 8.3.1. Carbon Nanotubes (CNTs) -- 8.3.2. Metal Nanowires -- 8.3.3. Semiconducting Nanowires -- 8.3.4. Other 1D Materials -- 8.4. Zero-Dimensional Materials -- 8.4.1. Metal Nanoparticles -- 8.4.2. Semiconducting Nanoparticles -- Exercises -- PART III: Integration Strategies -- Chapter 9: Substrates, Transfer, and Bonding -- 9.1. Introduction -- 9.2. Flexible Substrates -- 9.2.1. Metal Foil Substrates -- 9.2.2. Flexible Glass Substrates -- 9.2.3. Polymer Substrates -- 9.3. Transfer Printing |
| Notes |
Description based upon print version of record |
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9.3.1. Viscoelastic Stamp |
| Form |
Electronic book
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| ISBN |
9781000486193 |
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1000486192 |
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