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 Other relevant titles entries 278-2488 |
2023
Luo, Jun, author
Singapore : Springer, 2023
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2023
International Conference on Internet of Things and Connected Technologies (7th : 2022 : Patna, India)
Singapore : Springer, [2023]
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2023
International Conference on ICT for Sustainable Development (8th : 2023 : Panaji, India)
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2023
Baumann, Peter (Hochschule Bremen)
[Third edition]
Wiesbaden, Germany : Springer, [2023]
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2023
International Conference on Inventive Material Science Applications (5th : 2022 : Coimbatore, India)
Singapore : Springer, [2023]
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2023
Kim, Byung Il
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2023
International Conference on Recent Trends in Image Processing and Pattern Recognition (5th : 2022 : Kingsville, Texas)
Cham : Springer, [2023]
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2023
International Conference on Communication, Computing and and Electronics Systems (4th : 2022 : Coimbatore, India)
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2023
Cham, Switzerland : Springer, 2023
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2023
Cham : Springer, [2023]
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2023
Conference on Multidisciplinary Engineering and Technology (2022 : Kedah, Malaysia)
Cham, Switzerland : Springer, 2023
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2023
Singapore : Springer, 2023
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2023
Arya, Sandeep
Singapore : Springer Singapore Pte. Limited, 2023
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2023
Asia-Pacific International Symposium on Aerospace Techology (2021 : Jeju, South Korea)
Singapore : Springer, [2023]
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2023
International Conference on VLSI and Microwave and Wireless Technologies (2021 : Gorakhpur, India)
Singapore : Springer, [2023]
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2023
Xu, Liu-Jun (Physicist), author.
Singapore : Springer, [2023]
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2023
Singapore : Springer, [2023]
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2023
Singapore : Springer, [2023]
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2023
Amsterdam, Netherlands : Elsevier, 2023
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2023
Oxford : Woodhead Publishing, 2023
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2023
Cambridge, MA : Woodhead Publishing, an imprint of Elsevier, [2023]
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2023
Cambridge, MA : Woodhead Publishing, an imprint of Elsevier, [2023]
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2023
Second edition
Cambridge, MA : Woodhead Publishing, [2023]
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2023
Amsterdam ; Cambridge, MA : Elsevier, [2023]
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2023
Cambridge, MA : Woodhead Publishing, an imprint of Elsevier, [2023]
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2023
Cham : Springer, 2023
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2023
Singapore : Springer, [2023]
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2023
International Conference on Communication, Devices and Computing (4th : 2023 : Haida, India)
Singapore : Springer, 2023
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2023
Tao, Jiasheng, author
Singapore : Springer, [2023]
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2023
International Conference on Inventive Material Science Applications (6th : 2023 : Coimbatore, India)
Singapore : Springer, [2023]
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2023
Hilleringmann, Ulrich
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2023
Cambridge, United Kingdom ; New York, NY : Cambridge University Press, 2023
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2023
Khari, Manju
Newark : John Wiley & Sons, Incorporated, 2023
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2023
Juan P. Marinez-Pastor, author
Bellingham, Washington (1000 20th St. Bellingham WA 98225-6705 USA) : SPIE, 2023
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2023
Schreiber, Ulrich (Geodesist), author.
Cambridge, United Kingdom ; New York, NY : Cambridge University Press, 2023
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2022
Jabbar, M. A
1st ed
Aalborg : River Publishers, 2022
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2022
Parameswaranpillai, Jyotishkumar
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2022
Maruccio, Giuseppe
San Diego : Elsevier Science & Technology, 2022
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2022
Ren, Qiang
Newark : John Wiley & Sons, Incorporated, 2022
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2022
Newark : John Wiley & Sons, Incorporated, 2022
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2022
Pham, Tuân Anh
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2022
K. Srivastava, Prashant
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2022
Weinheim, Germany : Wiley-VCH, [2022]
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