1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,

Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)

Materials Park, OH : ASM International, [1992]

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1992-

Advanced packaging : an IHS Group publication

Libertyville, Ill., USA : IHS Pub. Group, [1992-]

 

 

European Microelectronics and Packaging Conference : [proceedings]

European Microelectronics and Packaging Conference

Piscataway, NJ : Institute of Electrical and Electronic Engineers ;

 

 

... IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics and ... IEEE Interdisciplinary Conference on Portable Information Devices

IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics

Piscataway, NJ : IEEE

 

 

Proceedings of technical papers

International Microsystems, Packaging, Assembly, and Circuits Technology Conference

Piscataway, NJ : Institute of Electrical and Electronics Engineers

 

2022-

IEEE transactions on signal and power integrity

[New York, New York] : IEEE, 2022-

 

2020

CMOS analog and mixed-signal circuit design : practices and innovations

Marzuki, Arjuna, 1975- author.
First edition
Boca Raton, FL : CRC Press, 2020

 

2019

Encapsulation technologies for electronic applications

Ardebili, Haleh, author.
Second edition
Oxford, United Kingdom : William Andrew, [2019]

 

2019

Semiconductor Material Technologies

Spexia, Stefano



 

2018

Advanced polyimide materials : synthesis, characterization, and applications

Amsterdam, Netherlands : Elsevier, [2018]

 

2017

More-than-Moore 2.5D and 3D SiP integration

Radojcic, Riko.



 

2016

Future trends in microelectronics.

Hoboken, New Jersey : John Wiley & Sons, 2016

 

2014

Manufacturing engineering and technology

Kalpakjian, Serope, 1928-
Seventh edition
Upper Saddle River, NJ : Pearson, [2014]

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2014

Electrical discharge machining (EDM) : types, technologies and applications

Hauppauge, New York : Nova Science Publishers, Inc., 2014

 

2014

Encyclopedia of thermal packaging.

New Jersey : World Scientific, 2014

 

2013

Understanding smart sensors

Frank, Randy.
Third edition
Boston : Artech House, [2013]

 

2013

Encyclopedia of thermal packaging.

 

2012

Molecular modeling and multiscaling issues for electronic material applications

 

2011

Sputtering materials for VLSI and thin film devices

Sarkar, Jaydeep, author

Norwich, N.Y. : William Andrew, 2011