Description |
1 online resource (1 volume (various pagings)) : illustrations |
Series |
McGraw-Hill packaging and electronics books |
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McGraw-Hill packaging and electronics books.
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Contents |
Foreword -- Section 1: Packaging Concepts and Design -- Introduction to Electronic Packaging -- Electronics Industry Overview -- Trends/Drivers in the Electronics Manufacturing Industry -- Area Array Packaging -- Stacked/3D Packages -- Compliant IC Packaging -- Flip Chip Technology -- Options in High-Density Part Cleaning -- MEMS Packaging and Assembly Challenges -- Ceramic Ball and Column Grid Array Overview -- Section 2: Materials -- Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills -- Hermetic Packaging Systems: Adhesive and Getter -- Area Array Solder Spheres, Pastes, and Fluxes -- Modern Solder and Solder Paste -- Lead-Free Systems and Process Implications -- Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? -- Section 3: Equipment and Processes -- Next-Generation Flip Chip Materials and Processes -- Flip Chip Assembly and Underfilling -- BGA and CSP Rework: What is Involved? -- BGA Assembly Reliability -- Die Attach and Rework -- Liquid Encapsulation Equipment and Processes -- Molding for Area Array Packages -- Screen Printing and Stenciling -- Criteria for Placement and Processing of Advanced Packages -- Ovens in Electronics -- Process Development, Control, and Organization -- Section 4: Economics and Productivity -- Metrics: The Key to Productivity -- Cost Estimating for Electronic Assembly -- Section 5: Future -- The Future of Electronic Packaging -- The Future of SMT Process Equipment -- Index |
Summary |
"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)." |
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Annotation *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI) |
Bibliography |
Includes bibliographical references and index |
Notes |
Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL |
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Print version record |
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digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL |
Subject |
Ball grid array technology.
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Microelectronic packaging.
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TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
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TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
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Ball grid array technology
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Microelectronic packaging
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Genre/Form |
Internet resources
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Form |
Electronic book
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ISBN |
1591243602 |
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9781591243601 |
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0071500650 |
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9780071500654 |
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9780071449458 |
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0071449450 |
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9780071374934 |
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0071374930 |
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9787130074934 |
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7130074930 |
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