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Book Cover
E-book
Author Gilleo, Ken.

Title Area array packaging handbook / Ken Gilleo
Published New York : McGraw-Hill, ©2002

Copies

Description 1 online resource (1 volume (various pagings)) : illustrations
Series McGraw-Hill packaging and electronics books
McGraw-Hill packaging and electronics books.
Contents Foreword -- Section 1: Packaging Concepts and Design -- Introduction to Electronic Packaging -- Electronics Industry Overview -- Trends/Drivers in the Electronics Manufacturing Industry -- Area Array Packaging -- Stacked/3D Packages -- Compliant IC Packaging -- Flip Chip Technology -- Options in High-Density Part Cleaning -- MEMS Packaging and Assembly Challenges -- Ceramic Ball and Column Grid Array Overview -- Section 2: Materials -- Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills -- Hermetic Packaging Systems: Adhesive and Getter -- Area Array Solder Spheres, Pastes, and Fluxes -- Modern Solder and Solder Paste -- Lead-Free Systems and Process Implications -- Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? -- Section 3: Equipment and Processes -- Next-Generation Flip Chip Materials and Processes -- Flip Chip Assembly and Underfilling -- BGA and CSP Rework: What is Involved? -- BGA Assembly Reliability -- Die Attach and Rework -- Liquid Encapsulation Equipment and Processes -- Molding for Area Array Packages -- Screen Printing and Stenciling -- Criteria for Placement and Processing of Advanced Packages -- Ovens in Electronics -- Process Development, Control, and Organization -- Section 4: Economics and Productivity -- Metrics: The Key to Productivity -- Cost Estimating for Electronic Assembly -- Section 5: Future -- The Future of Electronic Packaging -- The Future of SMT Process Equipment -- Index
Summary "Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)."
Annotation *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Bibliography Includes bibliographical references and index
Notes Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL
Print version record
digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL
Subject Ball grid array technology.
Microelectronic packaging.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
Ball grid array technology
Microelectronic packaging
Genre/Form Internet resources
Form Electronic book
ISBN 1591243602
9781591243601
0071500650
9780071500654
9780071449458
0071449450
9780071374934
0071374930
9787130074934
7130074930