Contents -- Foreword -- Preface -- Lead-Free Soldering and Environmental Compliance: An Overview -- Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects -- Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties -- Lead-Free Solder Joint Reliability Trends -- Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects -- Tin Whisker Growth on Lead-Free Solder Finishes -- Accelerated Testing Methodology for Lead-Free Solder Interconnects
Thermomechanical Reliability Prediction of Lead-Free Solder InterconnectsDesign for Reliability�Finite Element Modeling of Lead-Free Solder Interconnects -- Characterization and Failure Analyses of Lead-Free Solder Defects -- Reliability of Interconnects with Conductive Adhesives -- Lead-Free Solder Interconnect Reliability Outlook -- Index