| Description |
1 online resource (xxvi, 812 pages) : illustrations |
| Series |
IEEE Press series on microelectronic systems |
|
IEEE Press series on microelectronic systems.
|
| Contents |
Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization |
| Summary |
Annotation As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduatelevel textbook, have been retained. An Instructors Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department |
| Bibliography |
Includes bibliographical references and index |
| Notes |
Print version record |
| Subject |
Microelectronic packaging.
|
|
Electronic packaging.
|
|
Electronic packaging
|
|
Microelectronic packaging
|
| Form |
Electronic book
|
| Author |
Ulrich, Richard K. (Richard Kevin), 1955-
|
|
Brown, William D., 1943-
|
| ISBN |
9780471754503 |
|
0471754501 |
|
9780470544082 |
|
0470544082 |
|
