Cover; Guest editorial; New method for determining correction factors for pin-in-paste solder volumes; Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing; Optimization of solder paste quantity considering the properties of solder joints; The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials; X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage; Studying heat transfer on inclined printed circuit boards during vapour phase soldering
Real-time profiling of reflow process in VPS chamberStructure and thermal behavior of lead-free solders prepared by rapid solidification of their melt; Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates; Corrosion-induced tin whisker growth in electronic devices: a review
