Title Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging / Xing-Chang Wei

Published Boca Raton : CRC Press, Taylor & Francis Group, [2017] ©20

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Description 1 online resource Contents Electromagnetic compatibility for high-speed circuits -- Modal field of power-ground planes and grids -- Integral equation solutions -- Extraction of via parameters -- Printed circuit board-level electromagnetic compatibility design -- Interposer electromagnetic compatibility design -- New structures and materials Bibliography Includes bibliographical references and index Notes Print version record Subject Printed circuits -- Design and construction Electronic packaging. Electromagnetic compatibility. TECHNOLOGY & ENGINEERING -- Mechanical. Electromagnetic compatibility Electronic packaging Printed circuits -- Design and construction Form Electronic book ISBN 9781315305868 1315305860 9781315305875 1315305879 9781315305851 1315305852 9781315305844 1315305844

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