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E-book
Author ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.), creator.

Title ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : August 27-30, 2018, San Francisco, California, USA
Published New York, N.Y. : American Society of Mechanical Engineers, 2018
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Description 1 online resource (1 volume) : illustrations
Contents Heterogeneous integration: micro-systems with diverse functionality -- Servers of the future, IoT, and edge to cloud -- Structural and physical health monitoring -- Power electronics, energy conversion and storage -- Autonomous, hybrid, and electric vehicles
Bibliography Includes bibliographical references
Notes Online resource; title from ASME digital collection page (viewed November 13, 2018)
Subject Electronic packaging -- Congresses.
Electronic packaging.
Genre/Form Conference papers and proceedings.
Form Electronic book
Author American Society of Mechanical Engineers, publisher.
Other Titles Title at top of each PDF article: Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2018, August 27-30, 2018, San Francisco, CA, USA
Title from ASME website: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2018)
InterPACK2018
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