Title Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao

Published Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]

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Description 1 online resource Series Woodhead Publishing series in electronic and optical materials Series on advanced electronic packaging technology and key materials Woodhead Publishing series in electronic and optical materials. Series on advanced electronic packaging technology and key materials Bibliography Includes bibliographical references and index Notes Online resource; title from digital title page (viewed on February 4, 2020) Subject Electronic apparatus and appliances -- Packaging. Electronic apparatus and appliances -- Packaging Form Electronic book Author Che, Faxing, author Lin, Tingyu, author Zhao, Wensheng, author ISBN 9780081025338 0081025335

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