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Subjects (1-2 of 2)
Molded interconnect devices.
1
E-book
2014

11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September


International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg, Germany, and Fuerth, Germany)

Pfaffikon, Switzerland : TTP, 2014

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2
E-book
2015

Plasma etching processes for interconnect realization in VLSI




London : ISTE Press ; Oxford : Elsevier Ltd, 2015

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