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Subjects (1-3 of 3)
Electronic apparatus and appliances -- Plastic embedment.
1
2009
Encapsulation technologies for electronic applications
Ardebili, Haleh.
Rating:
Electronic Resources
2
2019
Encapsulation technologies for electronic applications
Ardebili, Haleh, author.
Second edition
Oxford, United Kingdom : William Andrew, [2019]
Rating:
Electronic Resources
More...
3
1980
Stress relief of ceramic components in high voltage assemblies
Heinen, R. J.
Springfield, Va. : National Technical Information Service, U.S. Dept. of Commerce, 1980
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W'PONDS FICHE
621.31937 Hei
AVAILABLE
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