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Subjects (1-3 of 3)
Electronic apparatus and appliances -- Plastic embedment.
1
E-book
2009

Encapsulation technologies for electronic applications


Ardebili, Haleh.
Burlington, MA : William Andrew, 2009

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2
E-book
2019

Encapsulation technologies for electronic applications


Ardebili, Haleh, author
Oxford, United Kingdom : William Andrew, [2019]

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3
Microform
1980

Stress relief of ceramic components in high voltage assemblies


Heinen, R. J.
Springfield, Va. : National Technical Information Service, U.S. Dept. of Commerce, 1980

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Location Call no. Vol. Availability
 W'PONDS FICHE  621.31937 Hei  AVAILABLE
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