| Description |
1 online resource (viii, 282 pages) : illustrations (some color) |
| Series |
Nanostructure Science and Technology, 1571-5744 ; volume 171 |
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Nanostructure science and technology ; v. 171. 1571-5744
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| Contents |
Copper Electrodepositon and Additive Chemistry -- Copper Electrodepositon / Masayuki Yokoi -- Supression Effect and Additive Chemistry / Masayuki Yokoi -- Acceleration Effect / Dale P. Barkey -- Modeling and Simulation / Yutaka Kaneko -- Copper on Chip Metallization -- Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects / James F. Rohan and Damien Thompson -- Microstructure Evolution of Copper in Nanoscale Interconnect Features / James Kelly, Christopher Parks, James Demarest, Juntao Li and Christopher Penny -- Direct Copper Plating / Aleksandar Radisic and Philippe M. Vereecken -- Through Silicon Via and Other Methods -- Through Silicon Via / Kazuo Kondo -- Build-up Printed Wiring Boards (Build-up PWBs) / Kiyoshi Takagi and Toshikazu Okubo -- Copper Foil Smooth on Both Sides for Lithium-Ion Battery / Akitoshi Suzuki and Jun Shinozaki -- Through Hole Plating / Wei-Ping Dow -- Erratum to: Acceleration Effect / Dale P. Barkey |
|
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating |
| Summary |
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ULSI wiring material based upon copper nanowiring ; Printed circuit boards ; Stacked semiconductors ; Through Silicon Via ; Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners |
| Bibliography |
Includes bibliographical references |
| Notes |
Online resource; title from PDF title page (SpringerLink, viewed November 25, 2013) |
| Subject |
Copper plating.
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TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.
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Chimie.
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Science des matériaux.
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Copper plating.
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| Form |
Electronic book
|
| Author |
Kondo, K. (Kazuo), editor.
|
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Akolkar, Rohan N., editor
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Barkey, Dale P., editor
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Yokoi, Masayuki, editor
|
| ISBN |
9781461491767 |
|
1461491762 |
|
1461491754 |
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9781461491750 |
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