Limit search to available items
Add Marked to Bag Add All On Page Add Marked to My Lists
Subjects (1-3 of 3)
Chip scale packaging
1
E-book
2019

Advances in embedded and fan-out wafer level packaging technologies



Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019

Rating:

 
 
2
E-book
2018

Fan-out wafer-level packaging


Lau, John H., author
Singapore : Springer, 2018

Rating:

 
3
E-book
2015

Wafer-level chip-scale packaging : analog and power semiconductor applications


Qu, Shichun, author
New York : Springer, [2015]

Rating:

 
Add Marked to Bag Add All On Page
Locate in results