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E-book
Author International Conference on Applied Materials and Electronics Engineering (2012 : Hong Kong, China)

Title Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / edited by Brendan Gan, Yu Gan and Y. Yu
Published Durnten-Zurich, Switzerland : Trans Tech Publications, ©2012

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Description 1 online resource (2 volumes) : illustrations
Series Advanced Materials Research ; v. 378-379
Advanced materials research ; v. 378-379.
Contents Applied Materials and Electronics Engineering; Sponsors and Committees; Table of Contents; Chapter 1: Applied Mechanics and Materials; The Study about Hole Distance Calculating Method of Wide-Space Bench Blasting; Molecular Dynamics Simulation of Crack Initiation of Aluminum under Tensile Deformation; Numerical Simulation of Shock Diffraction on Cartesian Grid; Numerical Simulation of Ring-Shape Rock Failure under Compressive Loading; Numerical Simulation of the Quasi-Static Axial Compression of the Pseudo-Elastic Phase Transformation Cylindrical Shells
Discussions on the Principle to Reduce the Sliding Fall Rock Impact Force against Protective StructureA Standing Wave-Duct System for Acoustical Property Prediction of Multi-Layered Noise Control Materials; Numerical Simulation on Combined Deformation of Tip-Loaded Cantilever Beam with Particle Flow Code; Hourglass Control Methods in Numerical Simulation Code RingForm; Acoustic Radiated Calculation of a Finite Cylindrical Shell and Interface Design of the Programs; Acoustic Emission Characteristics of Rock Failure under Uniaxial Loading
Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed SinteringInvestigation on Random Parameters of Aircraft Structural Reliability Model; Carbonation of Fly Ash Concrete and Micro-Hardness Analysis; Multi-Phase Explosion Detonation and JWL EOS Parameters Numerical Calculation; SHPB Experimental Investigation used for Concrete; The Patch Test of Numerical Manifold Schemes with Mixed Cover Coupled Velocity and Pressure for Steady N-S Equations; Numerical Simulation of Wave Propagation in Variable Cross-Section Bars
Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading II: Results and DiscussionStudy on Anoxic / Anaerobic / Aerobic Process to Treat Rural Domestic Wastewater; Analysis of the Force Characteristics of Stem to the Roots by SM Solver; Symplectic Solutions in Singularity Problems of Anisotropic Beams; Flow Field Analysis and Experiment Study on Air Losing of Hydraulic Retarder; Strain Measurements Based Finite Element Model Updating
Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading I: Experiment and Numerical Simulation MethodEffect of Heat Treatment on Al-40Si Alloy Modified by Sr Addition; The Reliability Analysis of Concrete Perforated Brick Wall Shrinkage Cracking; Inversion of Functionally Graded Materials to Improve the Elastic Ultimate Bearing Capacity of Thick-Walled Hollow Cylinder; Applications of Carbon Fiber Composites; Design of Safety Monitoring System for Super-Large Deep Foundation Pit in City Center
Summary This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials and other related fields. Combined with its wide coverage of applications, this collection will be welcomed by anyone working in these fields. Review from Book News Inc.: From the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), held in January 2012 in Hon
Bibliography Includes bibliographical references and indexes
Notes Print version record
Subject Electronics -- Congresses
Electronics -- Materials -- Congresses
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
Electronics
Electronics -- Materials
Genre/Form Conference papers and proceedings
Form Electronic book
Author Gan, Brendan
Gan, Yu
Yu, Y
ISBN 9783038137566
3038137561