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Authors (Last name first) (1-13 of 13)
Components, Packaging & Manufacturing Technology Society
1 1985- Electrical contacts IEEE Holm Conference on Electrical Contacts [Chicago] : Institute of Electrical and Electronics Engineers, [1985-] Rating:
2 Electrical Design of Advanced Packaging and Systems Symposium [proceedings] Electrical Design of Advanced Packaging and Systems Symposium Rating:
3 1999 Electronic and photonic circuits and devices Rating: Electronic Resources
4 1996 I-THERM : proceedings InterSociety Conference on Thermal Phenomena in Electronic Systems New York, N.Y. : IEEE, 1990-1996 Rating:
5 2010 IEEE transactions on advanced packaging a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society Rating:
6 2010 IEEE transactions on components and packaging technologies a publication of the IEEE Components, Packaging, and Manufacturing Technology Society Rating:
7 IEEE transactions on components, packaging, and manufacturing technology Rating:
8 1998 IEEE transactions on components, packaging, and manufacturing technology. a publication of the IEEE Components, Packaging, and Manufacturing Technology Society Rating:
9 1998 IEEE transactions on components, packaging, and manufacturing technology a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics So Rating:
10 1998 IEEE transactions on components, packaging, and manufacturing technology. a publication of the IEEE Components, Packaging, and Manufacturing Technology Society ; IEEE TAB Steering Committee on Design Rating:
11 1999- IEEE transactions on electronics packaging manufacturing : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society New York, NY : Institute of Electrical and Electronics Engineers, [1999-] Rating:
12 1998- ITHERM InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, issuing body Piscataway, NJ : IEEE, [1998-] Rating:
13 Proceedings International Advanced Packaging Materials Symposium. Rating:
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