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Most relevant titles entries 1-4
1 2021 3D microelectronic packaging : from architectures to applications Second edition Singapore : Springer, [2021] Rating: Electronic Resources More...
2 2017 3D microelectronic packaging : from fundamentals to applications Cham, Switzerland : Springer, [2017] Rating: Electronic Resources
3 2011 Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing Liu, S. (Sheng), 1963- Rating: Electronic Resources
4 2005 Force sensors for microelectronic packaging applications Schwizer, Jürg. Rating: Electronic Resources More...
Very relevant titles entries 5-56
5 2023 Chiplet design and heterogeneous integration packaging Lau, John H., author. Singapore : Springer, [2023] Rating: Electronic Resources
6 2022 Recent progress in lead-free solder technology : materials development, processing and performances Cham : Springer, [2022] Rating: Electronic Resources
7 2021 Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package Newark : John Wiley & Sons, Incorporated, 2021 Rating: Electronic Resources
8 2021 Nano-bio-electronic, photonic and MEMS packaging 2nd edition Cham : Springer, 2021 Rating: Electronic Resources More...
9 2020 Antenna-in-package technology and applications Hoboken, New Jersey : John Wiley & Sons, Inc., [2020] Rating: Electronic Resources
10 2020 TMS 2020 149th Annual Meeting and Exhibition Supplemental proceedings Minerals, Metals and Materials Society. Annual Meeting (149th : 2020 : San Diego, Calif.) Cham : Springer, 2020 Rating: Electronic Resources
11 2020 Influence of Temperature on Microelectronics and System Reliability : a Physics of Failure Approach Lall, Pradeep, author 1st edition Boca Raton : CRC Press, 2020 Rating: Electronic Resources
12 2019 Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition Tummala, Rao, author 2nd edition New York, N.Y. : McGraw-Hill Education, [2019] Rating: Electronic Resources
13 2019 Advances in Embedded and Fan-Out Wafer Level Packaging Technologies Keser, Beth, author 1st edition Wiley-IEEE Press, 2019 Rating: Electronic Resources
14 2019 Advances in embedded and fan-out wafer level packaging technologies Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019 Rating: Electronic Resources
15 2018 Ruthenium Chemistry Rating: Electronic Resources
16 2018 Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier, [2018] Rating: Electronic Resources
17 2018 Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method Seok, Seonho, author Cham : Springer International Publishing, [2018] Rating: Electronic Resources More...
18 2017 IMAPS (2016) Baoyong, Chi Rating: Electronic Resources
19 2017 IMAPS Poland 2016 Goosey, Martin Rating: Electronic Resources
20 2017 RF and microwave microelectronics packaging II Cham, Switzerland : Springer, 2017 Rating: Electronic Resources
21 2016 3D IC integration and packaging Lau, John H., author New York : McGraw-Hill Education, [2016] Rating: Electronic Resources
22 2015 Robust design of microelectronics assemblies against mechanical shock, temperature and moisture Wong, E. -H. (Ee-Hua), author. Cambridge, UK : Woodhead Publishing, [2015] Rating: Electronic Resources More...
23 2014 Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia) [Zurich], Switzerland : Trans Tech Publications, [2014] Rating: Electronic Resources More...
24 2014 Adhesion in microelectronics Hoboken, New Jersey : John Wiley and Sons, Inc., [2014] Rating: Electronic Resources
25 2014 Microwave and millimeter-wave electronic packaging Sturdivant, Rick, author. Boston [Massachusetts] ; London [England] : Artech House, 2014 Rating: Electronic Resources
26 2013 Hermeticity testing of MEMS and microelectronic packages Costello, Suzanne, author Boston : Artech House, [2013] Rating: Electronic Resources
27 2013 Microwave and Millimeter-Wave Electronic Packaging Sturdivant, Rick Rating: Electronic Resources
28 2012 LCP for microwave packages and modules Rating: Electronic Resources
29 2012 Fracture mechanics Sun, C. T. (Chin-Teh), 1939- Rating: Electronic Resources
30 2012 Bio and nano packaging techniques for electron devices : advances in electronic device packaging Rating: Electronic Resources More...
31 2011 Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10 International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China) Rating: Electronic Resources
32 2011 Semiconductor Packaging : Materials Interaction and Reliability Chen, Andrea Rating: Electronic Resources More...
33 2010 Advanced MEMS packaging Rating: Electronic Resources
34 2010 Electrochemical nanotechnologies Rating: Electronic Resources More...
35 2009 RF and microwave microelectronics packaging Rating: Electronic Resources More...
36 2008 Three-dimensional integration and modeling : a revolution in RF and wireless packaging Lee, Jong-Hoon. Rating: Electronic Resources
37 2008 Microjoining and nanojoining Rating: Electronic Resources
38 2008 Introduction to system-on-package (SOP) : miniaturization of the entire system Tummala, Rao R., 1942- Rating: Electronic Resources
39 2008 Materials for advanced packaging Rating: Electronic Resources More...
40 2008 Nanopackaging : nanotechnologies and electronics packaging Rating: Electronic Resources More...
41 2007 Physical design essentials : an ASIC design implementation perspective Golshan, Khosrow. Rating: Electronic Resources
42 2006 Advanced electronic packaging 2nd ed. / edited by Richard K. Ulrich, William D. Brown Rating: Electronic Resources
43 2005 Lead-free solder interconnect reliability Rating: Electronic Resources More...
44 2004- Journal of microelectronics and electronic packaging Rating:
45 2004 MEMS packaging Rating: Electronic Resources
46 2002 Area array packaging handbook Gilleo, Ken. Rating: Electronic Resources
47 2001 Fundamentals of microsystems packaging Rating: Electronic Resources
48 2001 Microvias : for low cost, high density interconnects Lau, John H. Rating: Electronic Resources
49 2001 Copper interconnect technology Steinbruchel, Christoph, author Bellingham, Washington : SPIE Optical Engineering Press, 2001 Rating: Electronic Resources
50 1999 Advanced electronic packaging : with emphasis on multichip modules Rating: Electronic Resources
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