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 entries 1-4
2
E-book
2017

3D microelectronic packaging : from fundamentals to applications



Cham, Switzerland : Springer, 2017

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3
Very relevant 

Very relevant titles

 entries 5-48
7
E-book
2020

Antenna-in-package technology and applications



Hoboken, New Jersey : Wiley-IEEE Press, [2020]

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8
E-book
2019

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition


Tummala, Rao, author
New York, N.Y. : McGraw-Hill Education, [2019]

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9
E-book
2019

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies


Keser, Beth, author
Wiley-IEEE Press, 2019

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11
E-book
2018

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability



Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier, [2018]

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12
E-book
2018

Ruthenium Chemistry



Singapore : Pan Stanford Publishing, 2018

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13
E-book
2017

RF and microwave microelectronics packaging II



Cham, Switzerland : Springer, 2017

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14
E-book
2017

IMAPS (2016)


Baoyong, Chi


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15
E-book
2017

IMAPS Poland 2016


Goosey, Martin


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16
E-book
2016

3D IC integration and packaging


Lau, John H., author.
New York : McGraw-Hill Education, [2016]

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17
E-book
2014

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31,


International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)
[Zurich], Switzerland : Trans Tech Publications, [2014]

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18
E-book
2014

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author
Boston [Massachusetts] ; London [England] : Artech House, 2014

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19
E-book
2014

Adhesion in microelectronics



Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]

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20
E-book
2013

Hermeticity testing of MEMS and microelectronic packages


Costello, Suzanne, author
Boston : Artech House, [2013]

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21
E-book
2013

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author
Norwood : Artech House, 2013

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22
E-book
2013

MEMS : fundamental technology and applications



Boca Raton : CRC Press, [2013]

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23
E-book
2012

Fracture mechanics


Sun, C. T. (Chin-Teh), 1939-
Waltham, Mass. : Butterworth-Heinemann/Elsevier, [2012]

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24
E-book
2012

LCP for microwave packages and modules



Cambridge ; New York : Cambridge University Press, 2012

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26
E-book
2011

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China,


International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Switzerland : Trans Tech Publications, 2011

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29
E-book
2010

Advanced MEMS packaging





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31
E-book
2008

Three-dimensional integration and modeling : a revolution in RF and wireless packaging


Lee, Jong-Hoon.
[San Rafael, Calif.] : Morgan & Claypool Publishers, [2008]

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32
 
36
E-book
2007

Physical design essentials : an ASIC design implementation perspective


Golshan, Khosrow.
New York : Springer, [2007]

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38
E-book
2005

Lead-free solder interconnect reliability



Materials Park, OH : ASM International, 2005

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40
E-book
2004

MEMS packaging



London : INSPEC, [2004]

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41
E-book
2002

Area array packaging handbook


Gilleo, Ken.


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42
E-book
2001

Copper interconnect technology


Steinbruchel, Christoph, author
Bellingham, Washington : SPIE Optical Engineering Press, 2001

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44
46
Book
1997

Fundamentals of microfabrication


Madou, Marc J.
Boca Raton, Fla. : CRC Press, [1997]

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Location Call no. Vol. Availability
 W'PONDS  621.38152 Mad/Fom  AVAILABLE
47
Book
1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,


Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)
Materials Park, OH : ASM International, [1992]

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Location Call no. Vol. Availability
 W'PONDS  621.381046 Ele/Epm 1992  AVAILABLE
Other relevant 

Other relevant titles

 entries 49-69
49
E-book
2020

CMOS analog and mixed-signal circuit design : practices and innovations


Marzuki, Arjuna, 1975- author.
Boca Raton, FL : CRC Press, [2020]

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50
E-book
2019

Encapsulation technologies for electronic applications


Ardebili, Haleh, author
Oxford, United Kingdom : William Andrew, [2019]

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