Other relevant titles

2023

Interconnect reliability in advanced memory device packaging

Gan, Chong Leong, author

Cham, Switzerland : Springer, [2023]

 

2022

Recent progress in lead-free solder technology : materials development, processing and performances

Cham : Springer, [2022]

 

2020

Assembly and reliability of lead-free solder joints

Lau, John H.



 

2016

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

Zhang, Qingke, author

Berlin : Springer, 2016

 

2016

Mitigating tin whisker risks : theory and practice

Hoboken, New Jersey : John Wiley & Sons, Inc., [2016]

 

2014

Fundamentals of lead-free solder interconnect technology : from microstructures to reliability

New York : Springer, [2014]

 

2012

Lead-free solders : materials reliability for electronics

Chichester, West Sussex : Wiley, 2012

 

2012

Lead free solder : mechanics and reliability

Pang, John Hock Lye



 

2012

Lead-free Solders : Materials Reliability for Electronics

Subramanian, K
2nd ed


 

2010

ISTFA 2010 : conference proceedings from the 36th International Symposium for Testing and Failure Analysis, November 14-18, 2010, InterContinental Hotel Dallas, Dallas, Texas, USA

International Symposium for Testing and Failure Analysis (36th : 2010 : Dallas, Tex.)

Materials Park, Ohio : ASM International, 2010

 

2010

Lead-free solder process development

Bath, Jasbir



 

2010

Global life cycle impact assessments of material shifts : the example of a lead-free electronics industry

Andrae, A. S. G. (Anders S. G.)



 

2008

Green electronics design and manufacturing : implementing lead-free and RoHS-compliant global products

Shina, Sammy G.



 

2008

Green electronics design and manufacturing : implementing lead-free and RoHS-compliant global products

Shina, Sammy G.

New York : McGraw-Hill, [2008]

Request It 

2007

A guide to lead-free solders : physical metallurgy and reliability

Evans, John W., 1957-



 

2007

Lead-free soldering

 

2007

Lead-free electronic solders : a special issue of Journal of Materials Science: Materials in Electronics

 

2007

Lead-free electronics : iNEMI projects lead to successful manufacturing

 

2006

Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

 

2005

Lead-free solder interconnect reliability

 

2003

Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials

 

2002

Area array packaging handbook

Gilleo, Ken.



 

2002

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies

Lee, Ning-Cheng.