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1
E-book
2020

VLSI-SoC : new technology enabler : 27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, Cusco, Peru, October 6-9, 2019, revised and extended selected papers


IFIP/IEEE International Conference on Very Large Scale Integration (27th : 2019 : Cusco, Peru)



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2
E-book
2019

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies


Keser, Beth, author
1st edition
Wiley-IEEE Press, 2019

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3
E-book
2019

Advances in embedded and fan-out wafer level packaging technologies




Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019

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4
E-book
2013

Novel Advances in Microsystems Technologies and Their Applications


Francis, Laurent A



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5
E-book
2011

Ultra-thin chip technology and applications






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6
E-book
2010

Wafer-level testing and test during burn-in for integrated circuits


Bahukudumbi, Sudarshan. author.



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Electronic Resources
7
E-book
2010

Wafer-Level Testing and Test During Burn-In for Integrated Circuits


Bahukudumbi, Sudarshan



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8
E-book
2008

Wafer level 3-D ICs process technology






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Electronic Resources
9
E-book
2000

Gate dielectric integrity : material, process, and tool qualification




West Conshocken, Pa. : ASTM, [2000]

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