Limit search to available items
2174 results found. Sorted by relevance | date | title .
Result Page   
Add Marked to Bag Add All On Page Add Marked to My Lists
Keywords (1-50 of 2174)
Most relevant 

Most relevant titles

 entries 1-17
1
E-book
2022

Thermal and structural electronic packaging analysis for space and extreme environments


Cepeda-Rizo, Juan, author.
Boca Raton, FL : CRC Press, 2022

Rating:

 
 
2
E-book
2022

Electronic packaging science and technology


Tu, K. N. (King-Ning), 1937- author.
Hoboken, NJ : Wiley, 2022

Rating:

 
 
3
 
4
E-book
2014

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author
Boston [Massachusetts] ; London [England] : Artech House, 2014

Rating:

 
 
5
E-book
2013

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author
Norwood : Artech House, 2013

Rating:

 
 
6
E-book
2012

Power electronic packaging : design, assembly process, reliability and modeling


Liu, Yong (Micro-optoelectronic mechanical systems professor)
New York : Springer, [2012]

Rating:

 
 
7
E-book
2011

Advanced materials for thermal management of electronic packaging


Tong, Xingcun Colin.
New York : Springer, [2011]

Rating:

 
 
8
E-book
2006

Advanced electronic packaging



Hoboken, NJ : Wiley-Interscience/IEEE ; [Chichester] : [John Wiley distributor], [2006]

Rating:

 
 
10
E-journal
2000-

Journal of electronic packaging



New York, NY : ASME, 2000-

Rating:

 
 
11
E-book
1999

Advanced electronic packaging : with emphasis on multichip modules



New York : IEEE Press, [1999]

Rating:

 
 
12
Book
1992

Electronic packaging : materials and processes to reduce package cycle time and improve reliability : proceedings of the 7th Electronic Materials and Processing Congress, 24-27 August 1992, Cambridge,


Electronic Materials and Processing Congress (7th : 1992 : Cambridge, Mass.)
Materials Park, OH : ASM International, [1992]

Rating:

Request It 
 
Location Call no. Vol. Availability
 W'PONDS  621.381046 Ele/Epm 1992  AVAILABLE
13
E-book
1990

Materials for high-density electronic packaging and interconnection


National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
Washington, D.C. : National Academy Press, 1990

Rating:

 
 
14
E-book
1900

Materials for High-Density Electronic Packaging and Interconnection


Packaging, Committee on Materials for High-Density Electronic
Washington : National Academies Press, 1900

Rating:

 
 
Very relevant 

Very relevant titles

 entries 18-119
18
E-book
2021

Polymer Composites for Electrical Engineering


Tanaka, Toshikatsu.


Rating:

 
 
19
E-book
2021

Prognostics and Remaining Useful Life (RUL) Estimation : Predicting with Confidence


Galar, Diego, author.
[Place of publication not identified] : CRC Press, 2021

Rating:

 
 
20
E-book
2020

Optical inspection of microsystems



Boca Raton, FL : CRC Press/Taylor & Francis Group, [2020]

Rating:

 
 
21
E-book
c2020

Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2019 : presented at ASME 2019 International Technical Con


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.)
New York : American Society of Mechanical Engineers, c2020

Rating:

 
 
22
E-book
2020

Lead-free soldering process development and reliability



Hoboken, NJ, USA : John Wiley & Sons, Inc., 2020

Rating:

 
 
23
E-book
2020

Electronic Scanned Array Design


Williams, John S.


Rating:

 
 
24
E-book
2020

Modeling, analysis, design, and tests for electronics packaging beyond Moore


Zhang, Hengyun, author
Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]

Rating:

 
 
25
E-book
2019

VLSI design and test for systems dependability



Tokyo, Japan : Springer, [2019]

Rating:

 
 
26
E-book
2019

Polymer and ceramic composite materials : emergent properties and applications


Ramdani, Noureddine, 1986- author.
Boca Raton : Taylor & Francis, CRC Press, 2019

Rating:

 
 
27
E-book
2019

RF and Microwave Module Level Design and Integration


Almalkawi, Mohammad, author
London : The Institution of Engineering and Technology, 2019

Rating:

 
 
28
E-book
2019

Advances in embedded and fan-out wafer level packaging technologies



Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019

Rating:

 
 
29
E-book
2019

Harsh environment electronics : interconnect materials and performance assessment



Weinheim, Germany : Wiley-VCH Verlag GmbH & Co., [2019]

Rating:

 
 
31
E-book
2019

Electronic enclosures, housings and packages


Süli, Frank, author
Duxford, United Kingdom : Woodhead Publishing, [2019]

Rating:

 
 
32
E-book
2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : August 27-30, 2018, San Francisco, California, USA


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.), creator.
New York, N.Y. : American Society of Mechanical Engineers, 2018

Rating:

 
 
33
E-book
2017

RF and microwave microelectronics packaging II



Cham, Switzerland : Springer, 2017

Rating:

 
 
34
E-book
2017

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Pro


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2017 : San Francisco, Calif.), creator
New York, N.Y. : American Society of Mechanical Engineers, 2017

Rating:

 
 
35
E-book
2017

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging


Wei, Xing-Chang, author.
Boca Raton : CRC Press, Taylor & Francis Group, [2017]

Rating:

 
 
36
E-book
2016

Experimental and applied mechanics. proceedings of the 2015 Annual Conference on Experimental and Applied Mechanics


Annual Conference on Experimental and Applied Mechanics (2015 : Costa Mesa, Calif.)
Cham : Springer, 2016

Rating:

 
 
37
E-book
2016

Mitigating tin whisker risks : theory and practice



Hoboken, New Jersey : John Wiley & Sons, Inc., [2016]

Rating:

 
 
38
E-book
2016

Advances in Polymer Materials and Technology



CRC Press, 2016

Rating:

 
 
39
E-book
2016

Practical guide to the packaging of electronics : thermal and mechanical design and analysis


Jamnia, Ali, 1961- author.
Boca Raton : Taylor & Francis, CRC Press, 2016

Rating:

 
 
40
E-book
2016

Printed circuits handbook



New York : McGraw-Hill Education, [2016]

Rating:

 
 
42
E-book
2015

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems : collocated with the ASME 2015 13th International Conference on Nanoch


ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, Calif.), creator
New York, N.Y. : American Society of Mechanical Engineers, 2015

Rating:

 
 
43
E-book
2014

Metal matrix composites : materials, manufacturing and engineering



Berlin/Boston : De Gruyter, 2014

Rating:

 
 
44
E-book
2014

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31,


International Conference on Packaging and Manufacturing Technology (3rd : 2013 : Brisbane Australia)
[Zurich], Switzerland : Trans Tech Publications, [2014]

Rating:

 
 
45
E-book
2014

Science and materials engineering IV : selected, peer reviewed papers from the Fourth National Congress of Science and Materials Engineering (CNCIM 2013), February 22-28, 2013, Pachuca, Mexico


National Congress of Science and Materials Engineering (4th : 2013 : Pachuca, Mexico)
Zurich, Switzerland : Trans Tech Publications, [2014]

Rating:

 
 
46
E-book
2014

Encyclopedia of thermal packaging.



New Jersey : World Scientific, 2014

Rating:

 
 
47
E-book
2014

Adhesion in microelectronics



Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]

Rating:

 
 
48
E-book
2014

Mechanical materials and manufacturing engineering III : selected, peer reviewed papers from the 2013 3rd International Conference on Mechanical Materials and Manufacturing Engineering (ICMMME 2013),


International Conference on Mechanical Materials and Manufacturing Engineering (3rd : 2013 : Shanghai, China), issuing body
Durnten-Zurich, Switzerland : Trans Tech Publications Ltd, [2014]

Rating:

 
 
49
E-book
2014

MEMS and nanotechnology. Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics


Annual Conference on Experimental and Applied Mechanics (2014 : Greenville, S.C.)
Cham : Springer, 2014

Rating:

 
 
50
E-book
2014

Handbook of thermoset plastics



San Diego : William Andrew, 2014

Rating:

 
 
Add Marked to Bag Add All On Page
Locate in results
Result Page