Title Advanced MEMS packaging / John H. Lau [and others]

Published New York : McGraw-Hill, ©2010

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Description 1 online resource (xxiii, 552 pages) : illustrations Contents Introduction to MEMS -- Advanced MEMS packaging -- Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices Summary Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices. -- Edited summary from book Bibliography Includes bibliographical references and index Notes Print version record Subject Microelectromechanical systems. Microelectronic packaging. TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics. TECHNOLOGY & ENGINEERING -- Electronics -- Digital. Microelectromechanical systems Microelectronic packaging Form Electronic book Author Lau, John H. ISBN 9781615831593 1615831592 9780071626231 0071626239 9780071627924 0071627928 9780071741835 0071741836

Other Titles Advanced microelectromechanical systems packaging

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