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Book Cover

Title Advanced electronic packaging
Edition Second edition / edited by Richard K. Ulrich, William D. Brown
Published Hoboken, NJ : Wiley-Interscience/IEEE ; [Chichester] : [John Wiley distributor], [2006]
Online access available from:
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Description 1 online resource (xxvi, 812 pages) : illustrations ; 26 cm
Series IEEE Press series on microelectronic systems
IEEE Press series on microelectronic systems.
Contents Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization
Notes Previous ed.: / William D. Brown. New York: IEEE, 1999
Bibliography Includes bibliographical references and index
Subject Microelectronic packaging.
Form Electronic book
Author Brown, William D., 1943-
Ulrich, Richard K. (Richard Kevin), 1955-
ISBN 0471466093 (hardback)
0471754501 (electronic bk.)
9780471466093 (hardback)
9780471754503 (electronic bk.)