| Description |
1 online resource (xxvi, 812 pages) : illustrations ; 26 cm |
| Series |
IEEE Press series on microelectronic systems |
|
IEEE Press series on microelectronic systems.
|
| Contents |
Acronyms -- Introduction and Overview of Microelectronic PackagingMaterials for Microelectronic Packaging -- Processing Technologies -- Organic Printed Circuit Board Materials and Processes -- Ceramic Substrates -- Electrical Considerations, Modeling, and Simulation -- Thermal Considerations -- Mechanical Design Considerations -- Discrete and Embedded Passive Devices -- Electronic Package Assembly -- Design Considerations -- Radio Frequency and Microwave Packaging -- Power Electronics Packaging -- Multichip and ThreeDimensional Packaging -- Packaging of MEMS and MOEMS: Challenges and a Case Study -- Reliability Considerations (PDF) -- Cost Evaluation and Analysis -- Analytical Techniques for Materials Characterization |
| Notes |
Previous ed.: / William D. Brown. New York: IEEE, 1999 |
| Bibliography |
Includes bibliographical references and index |
| Subject |
Microelectronic packaging.
|
| Form |
Electronic book
|
| Author |
Brown, William D., 1943-
|
|
Ulrich, Richard K. (Richard Kevin), 1955-
|
| ISBN |
0471466093 (hardback) |
|
0471754501 (electronic bk.) |
|
9780471466093 (hardback) |
|
9780471754503 (electronic bk.) |
|
